Manufacturer Part Number
10M08DCU324I7G
Manufacturer
Intel
Introduction
The 10M08DCU324I7G is an integrated circuit from Intel's MAX® 10 series, designed for embedded FPGA applications. It utilizes advanced technology to provide flexible, high-density programmable logic solutions.
Product Features and Performance
FPGA category: Embedded
Packaging form: Tray
Series: MAX® 10, representing a family of non-volatile FPGAs
Active product status, indicating ongoing production and support
Contains 500 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs)
Comprises 8,000 Logic Elements/Cells for versatile programming
Offers a total RAM of 387,072 bits for extensive data storage solutions
Supports 246 Input/Output (I/O) pins for wide connectivity options
Operable under voltage supply conditions ranging from 1.15V to 1.25V
Surface mount technology equipped for seamless integration into various circuit boards
Functions reliably within an operating temperature range of -40°C to 100°C (TJ)
Encased in a 324-LFBGA package for robust physical protection
Supplied in a 324-UBGA (15x15) device package for compatibility and standardization
Product Advantages
High density and flexibility due to a large number of logic elements and LABs/CLBs
Non-volatile FPGA architecture, enhancing device security and data retention
Extensive connectivity via a large number of I/O pins supports diverse applications
Efficient power consumption within a strictly defined voltage supply range
Wide operating temperature range ensures reliability under extreme conditions
Key Technical Parameters
Number of LABs/CLBs: 500
Number of Logic Elements/Cells: 8000
Total RAM Bits: 387072
Number of I/O: 246
Voltage Supply: 1.15V ~ 1.25V
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 324-LFBGA
Supplier Device Package: 324-UBGA (15x15)
Quality and Safety Features
Manufactured by Intel, ensuring high-quality standards and reliability
Strict compliance with operating temperature and power supply specifications to prevent overheating and ensure longevity
Compatibility
Surface mount compatibility allows integration into a wide range of PCB designs
Versatile I/O support facilitates connectivity with various peripheral devices
Application Areas
Ideal for embedded systems in automotive, telecommunications, computing, and consumer electronics
Suitable for IoT devices, smart home applications, and industrial automation
Product Lifecycle
The product status is active, indicating ongoing manufacturing and availability
No current indication of nearing discontinuation, ensuring long-term availability and support
Several Key Reasons to Choose This Product
Trusted manufacturer with a reputation for quality and reliability
High degree of programmability and flexibility for diverse embedded applications
Non-volatile FPGA ensures data security and instant-on functionality
Extensive I/O and memory capabilities support complex designs and functionalities
Broad operating temperature range accommodates harsh environmental conditions
Active product lifecycle status ensures long-term availability and technical support