Manufacturer Part Number
10M04SCU169C8G
Manufacturer
Intel
Introduction
Intel MAX® 10 FPGA for embedded systems integration
Product Features and Performance
250 LABs/CLBs for logic function implementation
4000 Logic Elements/Cells for design flexibility
Total RAM Bits 193536 enabling efficient memory use
130 I/Os for connectivity with peripherals and other ICs
85V to 3.465V supply voltage for low power operation
Surface Mount type for compact PCB design
Operating Temperature range of 0°C to 85°C ensuring reliability in varying environments
169-LFBGA packaging for reduced footprint
Product Advantages
Intel quality and performance assurance
High integration capacity for complex designs
Scalable and energy-efficient solution
Readable and reconfigurable design capabilities
Robust temperature range for diverse applications
Key Technical Parameters
Number of LABs/CLBs: 250
Number of Logic Elements/Cells: 4000
Total RAM Bits: 193536
Number of I/O: 130
Voltage - Supply: 2.85V ~ 3.465V
Operating Temperature: 0°C ~ 85°C
Package / Case: 169-LFBGA
Supplier Device Package: 169-UBGA (11x11)
Quality and Safety Features
Intel's rigorous quality control
Reliable operating temperature range for harsh environments
Compatibility
Compatible with various Intel development tools and software
Application Areas
Embedded systems
Industrial automation
Consumer electronics
Communications infrastructure
Product Lifecycle
Active status with ongoing support and availability
Not nearing discontinuation and replacement options available
Key Reasons to Choose This Product
Reputable manufacturer Intel guarantees quality
Active lifecycle status ensures long-term availability and support
Robust feature set facilitates complex embedded system design
Broad operating temperature accommodates diverse application conditions
Low-power consumption supports energy-efficient designs
Highly programmable FPGA allows for tailored functionality
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