Manufacturer Part Number
10AX048H2F34E2SG
Manufacturer
Intel
Introduction
High-performance FPGA designed for integration in embedded systems
Product Features and Performance
High density of 480,000 Logic Elements/Cells
183,590 Logic Array Blocks/LABs
A substantial 5,664,768 total RAM bits
Supports 492 I/Os for versatile connectivity
Operates on a low voltage supply of 0.87V to 0.98V
Surface Mount, 1152-BBGA, FCBGA for compact board integration
Functional at a wide operating temperature range of 0°C to 100°C (TJ)
Product Advantages
Efficient power consumption with low voltage requirements
Ample logic resources and memory for complex designs
High I/O count for extensive peripheral interfacing
Suitable for high-temperature applications
Key Technical Parameters
Number of LABs/CLBs: 183590
Number of Logic Elements/Cells: 480000
Total RAM Bits: 5664768
Number of I/O: 492
Voltage Supply Range: 0.87V ~ 0.98V
Operating Temperature Range: 0°C ~ 100°C (TJ)
Quality and Safety Features
Stringent quality control and testing by Intel
Reliable operation within specified temperature range
Compatibility
Compatible with various surface mount techniques
Works with standard power supply voltages in embedded systems
1152-FBGA, FC (35x35) package for integration in a variety of board sizes
Application Areas
Telecommunications
Data processing
Industrial control systems
Internet of Things (IoT) devices
High-performance computing applications
Product Lifecycle
Active product status, not nearing discontinuation
Long-term availability and support
Several Key Reasons to Choose This Product
Manufactured by Intel, a leader in semiconductor technology
Robust resource offerings for complex digital logic designs
Ideal for high-performance and high-temperature environments
Extensive connectivity options with a high number of I/O pins
Energy efficiency with optimized supply voltage support