Manufacturer Part Number
IS41LV16100D-50TLI
Manufacturer
Integrated Silicon Solution
Introduction
The IS41LV16100D-50TLI is a 16Mbit Dynamic Random Access Memory (DRAM) module designed for high-speed data processing.
Product Features and Performance
Technology: DRAM EDO (Extended Data Out)
Memory Size: 16Mbit
Memory Organization: 1M x 16, facilitating efficient data management and retrieval
Memory Interface: Parallel, ensuring robust data transfer capabilities
Access Time: 25 ns, allowing for rapid data access
Voltage Supply: 3V ~ 3.6V, compatible with low voltage applications
Operating Temperature Range: -40°C ~ 85°C, suitable for various environmental conditions
Mounting Type: Surface Mount, facilitating easier installation on circuit boards
Package / Case: 50-TSOP II with 44 leads, providing a compact footprint
Product Advantages
Extended Data Out (EDO) technology enhances the speed of data transfer compared to traditional DRAM
The wide operating temperature range makes it ideal for use in harsh environmental conditions
Low voltage operation reduces power consumption, making it suitable for energy-sensitive projects
Key Technical Parameters
Memory Type: Volatile
Access Time: 25 ns
Voltage Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Quality and Safety Features
The device adheres to stringent quality control measures ensuring reliability and durability
Compatibility
The parallel memory interface ensures compatibility with a broad range of microcontrollers and processors
Application Areas
Embedded systems
Consumer electronics
Telecommunications
Computing devices
Product Lifecycle
Status: Active
This product is currently active with no immediate discontinuation announced, and likely availability of replacements or upgrades in the future
Several Key Reasons to Choose This Product
High-speed data access enhances system performance
Low power consumption is ideal for portable and energy-efficient applications
Robust temperature range increases the reliability in extreme conditions
Surface mount package simplifies PCB design and reduces assembly costs
Compatibility with various devices broadens application potential