FX23-120S-0.5SV - Hirose Electric Co Ltd

Manufacturer Part Number

FX23-120S-0.5SV

Manufacturer

Hirose

Introduction

The Hirose FX23-120S-0.5SV is a high-performance rectangular connector array designed for mezzanine (board-to-board) applications. This connector features a compact and dense design, making it suitable for space-constrained environments.

Product Features and Performance

124 positions (120 signal contacts + 4 power contacts)

020" (0.50mm) contact pitch

2-row configuration

Surface mount mounting

Board guide feature for easy mating

Gold-plated contacts for reliable signal transmission

Mated stacking heights of 15mm and 20mm

Height above board of 0.268" (6.80mm)

Product Advantages

Compact and dense design for efficient board-to-board connectivity

Reliable signal transmission with gold-plated contacts

Ease of use with board guide feature for simple mating

Flexible stacking height options to accommodate different application requirements

Key Reasons to Choose This Product

Robust and durable construction for long-lasting performance

High-density connectivity solution for space-constrained designs

Seamless integration with a wide range of applications

Trusted Hirose brand quality and reliability

Quality and Safety Features

Rigorous quality control and testing procedures

Compliance with relevant industry standards and regulations

Compatibility

The Hirose FX23-120S-0.5SV connector is compatible with a wide range of PCB designs and can be used in various applications, including telecommunications, industrial automation, and medical equipment.

Application Areas

Telecommunications equipment

Industrial automation systems

Medical devices

Aerospace and defense electronics

Embedded systems

Product Lifecycle

The Hirose FX23-120S-0.5SV connector is an active product, and there are no immediate plans for discontinuation. Equivalent or alternative models are available from Hirose, and customers are advised to contact our website's sales team for the most up-to-date information on product availability and compatibility.