Manufacturer Part Number
FX12B-60P-0.4SV
Manufacturer
Hirose
Introduction
The FX12B-60P-0.4SV is a high-density, surface-mount rectangular connector from Hirose's FX12 series. Designed for mezzanine (board-to-board) applications, this connector features a compact and low-profile design, allowing for efficient space utilization in various electronic devices and systems.
Product Features and Performance
60 positions with a 0.40mm (0.016") pitch
2-row configuration
Solder retention feature for secure mounting
Gold-plated contacts for reliable signal transmission
Mated stacking height of 1.5mm
Height above board of 1.35mm (0.053")
Product Advantages
Compact and low-profile design for space-constrained applications
Robust solder retention feature for secure mechanical attachment
Gold-plated contacts for superior conductivity and corrosion resistance
Versatile mezzanine (board-to-board) connectivity solution
Key Reasons to Choose This Product
Optimized for high-density, space-efficient board-to-board interconnections
Reliable performance and long-term durability
Ease of installation and secure mounting
Trusted Hirose quality and reliability
Quality and Safety Features
RoHS-compliant design for environmental responsibility
Rigorous quality control and testing procedures to ensure reliability
Compatibility
The FX12B-60P-0.4SV connector is compatible with other FX12 series products from Hirose, enabling flexible and modular board-to-board connectivity solutions.
Application Areas
Telecommunications equipment
Industrial automation and control systems
Medical devices
Automotive electronics
Consumer electronics
Product Lifecycle
The FX12B-60P-0.4SV is an active product in the Hirose FX12 series. Hirose offers a range of equivalent and alternative models within the FX12 series to meet various application requirements. For more information on product availability and alternatives, please contact our website's sales team.