Manufacturer Part Number
FH19SC-5S-0.5SH(05)
Manufacturer
Hirose
Introduction
The FH19SC series is a compact and low-profile FFC/FPC connector with a 0.5mm pitch and up to 50 positions. It features a flip-lock mechanism for secure mating and is designed for high-density board-to-board or cable-to-board connections in consumer electronics, industrial, and automotive applications.
Product Features and Performance
5mm pitch and up to 50 positions
Surface mount, right-angle mounting
Flip-lock mechanism for secure mating
Zero Insertion Force (ZIF) design
Solder retention feature
Supports FFC/FPC thickness of 0.3mm
Operating temperature range of -55°C to 85°C
Current rating of 0.5A
Mating cycle of 20 times
Product Advantages
Compact and low-profile design for space-constrained applications
Secure locking mechanism for reliable connections
ZIF design for easy mating and unmating
Solder retention feature for robust assembly
Key Reasons to Choose This Product
Reliable and durable performance for critical applications
Versatile design to accommodate various FFC/FPC thicknesses
Compact footprint for efficient board space utilization
Competitive pricing and availability from a trusted manufacturer
Quality and Safety Features
UL94 V-0 flammability rating for housing materials
Gold-plated contacts for corrosion resistance
Rigorous quality control and testing processes
Compatibility
This FH19SC connector is compatible with a wide range of FFC/FPC cables and can be used in various consumer electronics, industrial, and automotive applications.
Application Areas
Consumer electronics (smartphones, tablets, laptops, etc.)
Industrial equipment (control panels, measuring instruments, etc.)
Automotive electronics (infotainment systems, dashboard displays, etc.)
Product Lifecycle
The FH19SC-5S-0.5SH(05) model is currently obsolete. However, Hirose offers several alternative and equivalent models in the FH19SC series to meet your connectivity needs. Please contact our website's sales team for more information on available options and product lifecycle updates.