Manufacturer Part Number
DF40HC(3.0)-70DS-0.4V(51)
Manufacturer
Hirose
Introduction
The Hirose DF40HC(3.0)-70DS-0.4V(51) is a high-density, surface mount rectangular connector designed for board-to-board applications. It features a compact and low-profile design, making it suitable for space-constrained electronics and devices.
Product Features and Performance
70 positions with a 0.4mm (0.016") pitch for high-density interconnections
2-row edge-type mezzanine connector design
Surface mount termination for easy PCB assembly
Gold-plated contacts for reliable signal transmission
Mated stacking height of 3mm for compact integration
Height above board of 2.90mm (0.114") for low-profile installation
Product Advantages
High-density interconnect solution for space-limited applications
Robust and reliable performance for mission-critical electronics
Easy surface mount integration for simplified PCB assembly
Key Reasons to Choose This Product
Compact and low-profile design to fit tight spaces
High-density connectivity with 70 positions in a small footprint
Excellent signal integrity and durability for long-term reliability
Simple surface mount installation for efficient manufacturing
Quality and Safety Features
Gold-plated contacts for superior conductivity and corrosion resistance
Robust construction and rigorous quality control for consistent performance
Compatibility
The DF40HC(3.0)-70DS-0.4V(51) is compatible with other products in the Hirose DF40 series and can be used in a variety of board-to-board and mezzanine applications.
Application Areas
Smartphones, tablets, and other portable electronics
Industrial control and automation equipment
Telecommunications and networking equipment
Medical devices and instrumentation
Automotive and transportation systems
Product Lifecycle
The DF40HC(3.0)-70DS-0.4V(51) is an active product in our website's sales team catalog. There are currently no plans for discontinuation, and our website's sales team offers a range of equivalent and alternative models within the DF40 series to meet various application requirements.