Manufacturer Part Number
DF37B-24DP-0.4V(53)
Manufacturer
Hirose
Introduction
This Hirose DF37B-24DP-0.4V(53) rectangular connector array is an edge-type, mezzanine (board-to-board) connector with a 24-position, 2-row design. It features a surface mount mounting type and solder retention for secure connections.
Product Features and Performance
24 positions in a 2-row configuration
016" (0.40mm) pitch
Gold-plated contacts with a thickness of 2.00 μin (0.051 μm) for reliable conductivity
Mated stacking height of 0.98mm
Height above board of 0.030" (0.75mm)
Product Advantages
Compact and space-saving design
Secure solder retention for reliable connections
Gold-plated contacts for consistent performance
Key Reasons to Choose This Product
Durable and high-quality construction for long-lasting use
Versatile board-to-board connectivity solution
Facilitates efficient and reliable data transmission
Quality and Safety Features
Designed and manufactured to Hirose's strict quality standards
Ensures safe and reliable operation in various applications
Compatibility
This connector is compatible with other Hirose DF37 series products.
Application Areas
Suitable for a wide range of electronic devices and systems that require board-to-board connectivity
Commonly used in telecommunications, industrial automation, and consumer electronics applications
Product Lifecycle
The DF37B-24DP-0.4V(53) is an active product. There are no known equivalent or alternative models at this time. For the latest information, please contact our sales team through our website.