Manufacturer Part Number
DF30FC-70DS-0.4V(81)
Manufacturer
Hirose
Introduction
The DF30FC-70DS-0.4V(81) is a high-density, surface-mount board-to-board connector from Hirose. It is part of the DF30 series and designed for applications requiring a compact, reliable, and versatile interconnect solution.
Product Features and Performance
70-position, 2-row, 0.4mm pitch design
Compact surface-mount footprint for space-constrained applications
Gold-plated contacts for superior conductivity and corrosion resistance
Mated stacking height of 0.9mm for low-profile assemblies
Height above board of 0.88mm for minimal protrusion
Product Advantages
Extremely compact and space-efficient design
Robust construction with gold-plated contacts for long-term reliability
Versatile mounting options for flexible board-to-board connectivity
Key Reasons to Choose This Product
Optimized for high-density, low-profile board-to-board interconnects
Proven performance and reliability from a trusted connector manufacturer
Cost-effective solution for a wide range of industrial and consumer electronics applications
Quality and Safety Features
Designed and manufactured to the highest quality standards
Compliant with relevant industry safety and regulatory requirements
Compatibility
Compatible with mating DF30 series connectors for board-to-board applications
Application Areas
Suitable for a wide range of industrial, consumer electronics, and telecommunications applications requiring high-density, low-profile board-to-board interconnects
Product Lifecycle
The DF30FC-70DS-0.4V(81) is an active product, with no plans for discontinuation
Equivalent and alternative models are available within the DF30 series, which offers a range of position counts and configurations to suit different application requirements
For more information on alternative models or product availability, please contact our sales team through our website.