Manufacturer Part Number
DF30FB-30DS-0.4V(82)
Manufacturer
hirose
Introduction
The DF30FB-30DS-0.4V(82) is a rectangular connector array with an edge-type, mezzanine (board-to-board) design. It features a compact and space-saving profile, making it suitable for applications with tight space constraints.
Product Features and Performance
30-position connector with a 0.40mm (0.016") pitch
2-row configuration
Surface mount mounting type
Solder retention feature for secure attachment
Gold-plated contacts for reliable conductivity
Mated stacking height of 0.9mm
Height above the board of 0.88mm (0.035")
Product Advantages
Compact and space-saving design
Secure solder retention for reliable connections
Gold-plated contacts for long-lasting performance
Suitable for board-to-board applications with tight space requirements
Key Reasons to Choose This Product
Optimized for compact and space-constrained designs
Reliable solder retention and gold-plated contacts ensure durable connections
Ideal for a wide range of board-to-board interconnect applications
Quality and Safety Features
Manufactured to high-quality standards by a reputable brand
Designed with safety and reliability in mind
Compatibility
The DF30FB-30DS-0.4V(82) is compatible with other components in the DF30 series and can be used in various board-to-board applications.
Application Areas
Telecommunication equipment
Industrial automation and control systems
Medical devices
Consumer electronics
Automotive electronics
Product Lifecycle
The DF30FB-30DS-0.4V(82) is currently in the obsolete stage. Customers are advised to contact our website's sales team for information on equivalent or alternative models that may be available.