Manufacturer Part Number
BM10NB(0.6)-60DS-0.4V(51)
Manufacturer
Hirose
Introduction
The Hirose BM10NB(0.6)-60DS-0.4V(51) is a high-density, surface mount, rectangular connector array designed for board-to-board applications. It offers a compact and reliable connection solution with a low profile and solder retention feature.
Product Features and Performance
60-position connector with a 0.40mm (0.016") pitch
2-row configuration
Surface mount mounting type
Solder retention feature for secure connection
Gold-plated contacts with a thickness of 2.00μin (0.051μm)
Mated stacking height of 0.6mm
Height above board of 0.024" (0.61mm)
Product Advantages
Compact and space-saving design
Reliable solder retention for secure connection
High-density connector solution
Facilitates board-to-board interconnections
Key Reasons to Choose This Product
Optimized for high-density board-to-board applications
Robust solder retention feature ensures a secure connection
Compact design saves valuable board space
Gold-plated contacts provide superior conductivity and corrosion resistance
Quality and Safety Features
Designed and manufactured to Hirose's high-quality standards
Meets relevant industry safety and performance standards
Compatibility
Suitable for a wide range of board-to-board applications
Application Areas
Telecommunications equipment
Industrial automation systems
Portable electronics
Aerospace and defense applications
Product Lifecycle
This product is discontinued and considered obsolete. Customers are advised to contact our website's sales team for information on equivalent or alternative models that may be available.