GD25LQ256DYIGR - GigaDevice Semiconductor (HK) Limited

Manufacturer Part Number

GD25LQ256DYIGR

Manufacturer

GigaDevice

Introduction

High-performance, low-power, Serial Peripheral Interface (SPI) NOR Flash memory

Designed for embedded systems and industrial applications

Product Features and Performance

256Mb (32M x 8) memory capacity

Supports SPI Quad I/O interface for high-speed data transfer

Operating voltage range: 1.65V to 2V

Operating temperature range: -40°C to 85°C

Fast read and write speeds (up to 120MHz clock frequency)

Low power consumption in active and standby modes

Reliable data retention and endurance (100,000 erase/program cycles)

Flexible sector/block erase architecture

Product Advantages

High-density, high-speed NOR Flash memory

Low power consumption for energy-efficient applications

Wide operating temperature range for industrial use

Robust data reliability and endurance

Key Technical Parameters

Memory Size: 256Mbit

Memory Interface: SPI Quad I/O

Operating Voltage: 1.65V to 2V

Operating Temperature: -40°C to 85°C

Clock Frequency: Up to 120MHz

Write Cycle Time: 2.4ms

Quality and Safety Features

RoHS3 compliant

Meets industrial-grade quality standards

Robust data retention and endurance

Compatibility

Designed for surface mount applications

Compatible with a wide range of embedded systems and industrial devices

Application Areas

Embedded systems

Industrial automation and control

Automotive electronics

Consumer electronics

IoT devices

Product Lifecycle

This product is currently in active production and availability.

Replacement or upgrade options may be available from the manufacturer.

Key Reasons to Choose This Product

High-performance, high-density NOR Flash memory for demanding applications

Low power consumption and wide operating temperature range

Reliable data retention and endurance

Flexible memory organization and erase architecture

Compatibility with a wide range of embedded systems and industrial devices