MPC8260AVVPJDB - Freescale Semiconductor

Manufacturer Part Number

MPC8260AVVPJDB

Manufacturer

NXP Semiconductors

Introduction

High-performance integrated microprocessor for embedded applications

Product Features and Performance

PowerPC G2 core

Single-core 32-bit architecture

300MHz clock speed

Communications Processor Module (CPM) for RISC operations

Supports DRAM and SDRAM memory controllers

No graphics acceleration

Contains three 10/100Mbps Ethernet controllers

Operates at I/O voltage of 3.3V

Surface mount 480-LBGA package

Product Advantages

Robust PowerPC core for reliable processing

Integrated communication interfaces facilitate versatile connectivity

Operational across a wide temperature range from 0°C to 105°C

Enhanced data processing with the RISC CPM

Key Technical Parameters

Core Processor: PowerPC G2

Number of Cores/Bus Width: 1 Core, 32-Bit

Speed: 300MHz

Co-Processors/DSP: Communications; RISC CPM

RAM Controllers: DRAM, SDRAM

Ethernet: 10/100Mbps (3)

Voltage - I/O: 3.3V

Operating Temperature: 0°C ~ 105°C (TA)

Mounting Type: Surface Mount

Package / Case: 480-LBGA Exposed Pad

Supplier Device Package: 480-TBGA (37.5x37.5)

Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART

Quality and Safety Features

Operational reliability in a broad temperature range

Compatibility

Supports common interface standards like I2C, SPI, UART, USART

Application Areas

Embedded systems, communication infrastructure, industrial applications

Product Lifecycle

Obsolete

Replacements or upgrades may be available

Reasons to Choose This Product

Integrated multiple communications interfaces

Support for widespread memory types

Designed for embedded applications requiring high-speed processing

Extended temperature range for use in various environments

PowerPC G2 architecture for performance and efficiency