MC9S08SE8VTG - Freescale Semiconductor

Manufacturer Part Number

MC9S08SE8VTG

Manufacturer

NXP Semiconductors

Introduction

The MC9S08SE8VTG is an 8-bit microcontroller from NXP's S08 series, designed for embedded control applications.

Product Features and Performance

Core Processor: S08

Core Size: 8-Bit

Speed: 20MHz

Connectivity: LINbus, SCI (Serial Communication Interface)

Peripherals: Low Voltage Detect (LVD), Power-On Reset (POR), Pulse Width Modulation (PWM)

Number of I/O: 14

Program Memory Size: 8KB FLASH

RAM Size: 512 Bytes

Voltage Supply Range: 2.7V to 5.5V

Data Converters: 10-channel 10-bit Analog-to-Digital Converter (A/D)

Oscillator Type: Internal

Operating Temperature Range: -40°C to 105°C

Mounting Type: Surface Mount

Package: 16-TSSOP

Product Advantages

Wide operating voltage range suitable for various power environments

Integrated peripherals reduce the need for external components

High temperature tolerance for demanding applications

Compact TSSOP package for space-constrained designs

Key Technical Parameters

8KB of programmable FLASH memory

20MHz maximum CPU speed

10-bit resolution A/D converter

14 configurable input/output pins

Quality and Safety Features

Built-in low voltage detection for system reliability

Power-on reset circuit to ensure proper startup

Compatibility

General compatibility with S08 microcontroller family

Compatible with LINbus for automotive and industrial networks

Application Areas

Automotive systems

Industrial control

Consumer electronics

Home appliances

Product Lifecycle

Current status: Active

Not nearing discontinuation

Replacements or upgrades may become available as technology evolves

Several Key Reasons to Choose This Product

Scalability within the S08 product family allows for future expansion

Robust design operates reliably in extreme temperatures from -40°C to 105°C

Integrated SCI and LINbus interfaces facilitate easy serial communication setup

The high degree of integration offers a cost-effective solution

Small footprint TSSOP packaging enables use in compact electronic assemblies