Manufacturer Part Number
MC908AP64ACFAE
Manufacturer
nxp-semiconductors
Introduction
The MC908AP64ACFAE is an embedded microcontroller based on the HC08 core, designed primarily for a wide range of automated control processes.
Product Features and Performance
Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Number of I/O: 32
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
RAM Size: 2K x 8
Voltage Supply (Vcc/Vdd): 4.5V ~ 5.5V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package/Case: 48-LQFP (7x7)
Product Advantages
High programmable memory size for complex applications
Wide range of connectivity options for flexible system integration
Extensive peripheral support enhances functionality
Durable operating temperature range for reliability in various environments
Efficient power requirement compatible with standard power supplies
Key Technical Parameters
Speed: 8MHz
Program Memory Size: 64KB
RAM Size: 2K x 8
Number of I/O: 32
Operating Temperature: -40°C ~ 85°C
Quality and Safety Features
Low Voltage Detection (LVD) for system protection
Power-on Reset (POR) for system stability on power-up
Compatibility
Compatible with I2C, SCI, SPI for communication with other devices
Surface mount technology for compatibility with modern PCB design
Application Areas
Industrial control systems
Consumer electronics
Automotive applications
Communication systems
Product Lifecycle
Not For New Designs, indicating the availability of more current or advanced products
Customers are encouraged to consider newer replacements or upgrades for future designs
Several Key Reasons to Choose This Product
High reliability for critical applications with its extended operating temperature range and safety features
Flexible system design options due to a variety of connectivity and peripheral supports
Suitable for complex applications thanks to large program memory and RAM
Easy integration into existing designs with surface mount packaging and standard voltage requirements