Manufacturer Part Number
MC8641DVJ1333JE
Manufacturer
NXP Semiconductors
Introduction
Embedded Dual-Core PowerPC Microprocessor
Product Features and Performance
Dual-Core e600 PowerPC Architecture
32-Bit Bus Width
333GHz Operating Frequency
Integrated DDR and DDR2 RAM Controllers
Supports 10/100/1000Mbps Ethernet (4 ports)
Surface Mount Technology
Advanced 1023-BCBGA, FCCBGA Packaging
Product Advantages
Dual-Core for Enhanced Multitasking
High-Speed Ethernet Connectivity for Networking Applications
Extended Operating Temperature Range 0°C to 105°C
Large Ball Grid Array Package for Robust PCB Mounting
Key Technical Parameters
Two Cores with 32-Bit Processing at 1.333GHz
Multiple Voltage I/O for System Flexibility (1.8V, 2.5V, 3.3V)
Support for Integrated Peripherals and Multiple Interfaces
1033-BCBGA (33x33) Package Footprint
Quality and Safety Features
Robust Surface Mount Package
Supports Wide Operating Temperature Range
Compatibility
Standard Dual Universal Asynchronous Receiver Transmitter (DUART)
High-Speed Serial Interface (HSSI)
Inter-Integrated Circuit (I2C) Interface
Support for RapidIO Interconnect Standard
Application Areas
Embedded Systems
Networking Equipment
Telecommunication Infrastructure
Control and Automation Systems
Product Lifecycle
Obsolete Status
May Require Sourcing from Secondary Market for Maintenance
Potential Consideration of Alternatives for New Designs
Several Key Reasons to Choose This Product
Multicore Performance for Embedded Computing Tasks
Ethernet Capabilities Suited for Networked Solutions
Supports Various I/O Voltages for System Integration
Wide Temperature Range for Industrial Applications
Mature Package Design for Reliability in Mounting