MC33FS6502LAE - NXP Semiconductors

Manufacturer Part Number

MC33FS6502LAE

Manufacturer

NXP Semiconductors

Introduction

The MC33FS6502LAE is a highly integrated system basis chip (SBC) solution designed for demanding automotive applications. It combines a range of power management, sensor interface, and control functionalities into a single package, enabling efficient and reliable system design.

Product Features and Performance

Integrated power management functionalities including voltage regulation, current monitoring, and overcurrent protection

Supports multiple supply voltages from 1V to 5V

Wide operating temperature range of -40°C to 125°C

Surface mount package with 48-LQFP Exposed Pad form factor

Supplier device package: 48-HLQFP (7x7)

Product Advantages

Comprehensive integration of essential system components reduces overall component count and simplifies board design

High reliability and robustness for demanding automotive applications

Flexible power supply support and wide operating temperature range

Key Reasons to Choose This Product

Optimized for efficient and reliable system integration in automotive applications

Comprehensive power management and interface functionalities in a single chip

Proven performance and quality from a trusted semiconductor manufacturer

Quality and Safety Features

Designed to meet automotive industry standards and requirements

Robust overcurrent and temperature protection mechanisms

Compatibility

Suitable for a wide range of automotive system designs and applications

Application Areas

Automotive systems

Industrial control

Transportation

Product Lifecycle

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