XPC823EVR66B2 - NXP USA Inc.

Manufacturer Part Number

XPC823EVR66B2

Manufacturer

NXP Semiconductors

Introduction

Embedded PowerPC core microprocessor

Product Features and Performance

PowerPC core architecture

32-bit bus width

66MHz operating speed

Communications and RISC Central Processor Module

Support for DRAM memory controllers

LCD and Video display interface controllers

Integrated 10Mbps Ethernet controller

USB 1.x interface support

Operational temperature range 0°C to 95°C

Product Advantages

Unified communications processor module for various protocols

Efficient 32-bit PowerPC core design

Integrated peripherals reducing external components

Low power operation suitable for embedded applications

Key Technical Parameters

Core Processor: PowerPC

Number of Cores/Bus Width: 1 Core, 32-Bit

Speed: 66MHz

Ethernet: 10Mbps

USB: USB 1.x

Voltage - I/O: 3.3V

Operating Temperature: 0°C ~ 95°C

Mounting Type: Surface Mount

Package / Case: 256-BBGA

Supplier Device Package: 256-PBGA (23x23)

Quality and Safety Features

Designed to meet IEC standards for electronic components

Surface mount technology for secure PCB mounting

Compatibility

Memory: DRAM supported

Display Interfaces: LCD, Video

Communication Interfaces: I2C, SMC, SCC, SPI, UART

Application Areas

Embedded systems

Industrial controls

Networking equipment

Communication devices

Product Lifecycle

Obsolete – nearing discontinuation

Replacements or upgrades might be limited or require redesign

Several Key Reasons to Choose This Product

Based on reliable and proven PowerPC architecture

One-chip solution for processing and communication needs

Supports a range of embedded memory and interface standards

Suitable for temperature-varied environments from 0°C to 95°C

Legacy support for industrial and networking applications