S9S08SG4E2MTGR - NXP USA Inc.

Manufacturer Part Number

S9S08SG4E2MTGR

Manufacturer

NXP Semiconductors

Introduction

The S9S08SG4E2MTGR is an embedded microcontroller from NXP's S08 series designed for a wide range of applications requiring efficient data processing and reliable operation.

Product Features and Performance

8-Bit S08 Core Processor

40MHz Maximum Speed

I2C, LINbus, SCI, SPI Connectivity Options

Low Voltage Detect (LVD), Power-On Reset (POR), Pulse Width Modulation (PWM), Watchdog Timer (WDT) Peripherals Included

12 I/O Pins

4KB FLASH Program Memory

256 Bytes RAM

10-bit Analog-to-Digital Converter with 8 Channels

Internal Oscillator for Device Clocking

Extended Operating Temperature Range from -40°C to 125°C

Product Advantages

Optimal balance between performance and power consumption

Robust peripheral set suitable for varied application needs

Small package size conducive to space-constrained designs

Flexibility in use due to a wide voltage supply range

High reliability with built-in safety features

Key Technical Parameters

Core Size: 8-Bit

Speed: 40MHz

Program Memory Size: 4KB (4K x 8)

RAM Size: 256 x 8

Voltage - Supply (Vcc/Vdd): 2.7V to 5.5V

Mounting Type: Surface Mount

Quality and Safety Features

Low Voltage Detect (LVD) prevents under-voltage conditions

Power-On Reset (POR) ensures reliable operation from startup

Watchdog Timer (WDT) mitigates software faults

Compatibility

Compatible with S08 series of microcontrollers

16-TSSOP Package Standardized for Easy PCB Design

Application Areas

Automotive Control Systems

Industrial Automation

Consumer Electronics

Communication Devices

Product Lifecycle

Active status product

Not near discontinuation

Upgrades and replacements are likely available

Several Key Reasons to Choose This Product

High-speed 8-bit processing capabilities for responsive applications

Integration of critical communication interfaces supporting a variety of protocols

Comprehensive set of peripherals enabling versatile system designs

High reliability and extended temperature range fit for harsh environments

Ease of integration into multiple form factors due to the compact 16-TSSOP package

Long-term availability being in the active stage of the product lifecycle