Manufacturer Part Number
S9S08SC4E0CTG
Manufacturer
NXP Semiconductors
Introduction
Embedded microcontroller within NXP's S08 series designed for automotive and industrial applications.
Product Features and Performance
40MHz S08 8-Bit core processor
LINbus and SCI connectivity options
Includes Low Voltage Detect (LVD), Power-on Reset (POR), Pulse Width Modulation (PWM), Watchdog Timer (WDT)
12 Input/Output ports for versatile interfacing
4KB Flash memory
256 bytes of RAM
Internal oscillator
Analog-to-Digital Converter (ADC) with 8 channels at 10-bit resolution
Operational over a wide temperature range from -40°C to 85°C
Product Advantages
Robust instruction set for efficient processing
Enhanced durability with wide operating temperature range
Dependable in-system programmable FLASH memory
Small footprint and surface-mount technology ensure compact design
Suitable for automated mass production processes
Key Technical Parameters
Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: LINbus, SCI
Number of I/O: 12
Program Memory Size: 4KB
RAM Size: 256 x 8
Voltage - Supply: 4.5V ~ 5.5V
Data Converters: A/D 8x10b
Operating Temperature: -40°C ~ 85°C
Quality and Safety Features
Built-in LVD for overvoltage protection
Integrated POR for reliable power-up initializations
PWM for controlled output variations
WDT to avoid system crashes
Certified operational reliability under extreme conditions
Compatibility
Compatible with a range of microcontroller peripherals and debugging tools
Application Areas
Automotive control systems
Industrial automation
Consumer electronics
Smart sensors
Embedded systems
Product Lifecycle
Active product with ongoing manufacturer support
Availability of replacements or upgrades not specified
Several Key Reasons to Choose This Product
The high-speed 8-bit processing capability for real-time applications
Comprehensive peripheral set enhances versatility
Low-power consumption for energy-efficient designs
Flash memory for reliable and secure firmware storage
Ready-to-use internal oscillator reduces external component needs
Simple and cost-effective surface-mount packaging
Ideal for space-constrained embedded systems due to TSSOP packaging
NXP reliability and post-sale support