PTN36001HXZ - NXP USA Inc.

Manufacturer Part Number

PTN36001HXZ

Manufacturer

nxp-semiconductors

Introduction

PTN36001HXZ is a high-performance USB 3.0 signal buffer/re-driver designed to enhance signal quality across long cables or noisy environments, facilitating high-speed data transfer.

Product Features and Performance

Designed for USB 3.0 applications

Features input equalization and output de-emphasis to improve signal integrity

Dual-channel operation

Supports high-speed data rates

Surface mount 12-XFQFN package for compact integration

Operates within a temperature range of 0°C to 85°C

Product Advantages

Enhances USB 3.0 signal quality and integrity over long distances

Compact size facilitates easy integration in space-constrained applications

Input equalization and output de-emphasis functionality optimize performance in noisy environments

Active product status ensures ongoing availability and support

Key Technical Parameters

Interface Type: Buffer, ReDriver

Applications: USB 3.0

Number of Channels: 2

Package/Case: 12-XFQFN

Operating Temperature: 0°C ~ 85°C

Quality and Safety Features

Manufactured by NXP Semiconductors, ensuring high-quality and reliability

Operates reliably within the specified temperature range

Compatibility

Suitable for use in USB 3.0 signal buffering applications

Designed for surface mount integration, compatible with modern PCB assembly processes

Application Areas

USB 3.0 data transmission systems

High-speed digital signal buffering and conditioning

Consumer electronics

Computer peripherals

Product Lifecycle

The product is currently active with no immediate discontinuation in sight, ensuring long-term availability.

Future upgrade and replacement options may be provided by NXP as technology progresses.

Several Key Reasons to Choose This Product

Robust signal conditioning features optimize USB 3.0 signal integrity and performance.

Compact and efficient design by a reputable manufacturer, NXP Semiconductors.

Suitable for a wide range of high-speed data transfer applications.

Ensures product longevity and availability, supporting long-term project requirements.

Easy integration into existing systems due to its surface mount package and compatibility with modern manufacturing processes.