P1022NXE2HFB - NXP USA Inc.

Manufacturer Part Number

P1022NXE2HFB

Manufacturer

NXP Semiconductors

Introduction

Embedded PowerPC e500v2 microprocessor tailored for embedded applications.

Product Features and Performance

Dual-core PowerPC e500v2 CPU architecture

32-Bit Bus Width

Clock Speed of 1.055GHz

Integrated Security Co-Processor (SEC)

Supports DDR2 and DDR3 RAM Controllers

Dual Gigabit Ethernet Controllers

Two SATA 3Gbps Interfaces

Two USB 2.0 Ports with Integrated PHY

Operating Temperature Range from -40°C to 125°C

Surface Mount, 689-BBGA Exposed Pad Package

Additional Interfaces include DUART, I2C, I2S, MMC/SD, SPI

Product Advantages

Consolidated security features with cryptography and random number generation

High-speed connectivity options

Supports a broad temperature range for harsh environments

Versatile memory controller supporting multiple memory types

Key Technical Parameters

Core Processor: PowerPC e500v2

Number of Cores/Bits: 2 Core, 32-Bit

Speed: 1.055GHz

Co-Processors/DSP: Security

Ethernet: Dual 10/100/1000Mbps

SATA Ports: Two SATA 3Gbps

USB Ports: Two USB 2.0

Operating Temperature: -40°C to 125°C

Quality and Safety Features

Advanced cryptography and security protocols

Robust construction for high reliability

Extended temperature operation suitable for industrial-grade applications

Compatibility

Compatibility with multiple I/O standards such as USB, SATA, Ethernet

Flexible RAM controller compatible with DDR2 and DDR3 modules

Application Areas

Embedded Computing

Networking Equipment

Industrial Control Systems

Security Systems

Product Lifecycle

Status: Obsolete

Implications: Availability limited, consider replacements or upgrades

Several Key Reasons to Choose This Product

Dual-core performance for multitasking and parallel processing

Integrated security features providing enhanced data protection

High integration reduces overall system component count and cost

Multi-protocol support enhances versatility and potential uses

NXP's reputation for longevity and support even for obsolete products

Robust thermal and package design enabling deployment in rugged conditions