Manufacturer Part Number
MPC860DEZQ50D4R2
Manufacturer
NXP Semiconductors
Introduction
High-performance embedded microprocessor designed for a wide range of applications, featuring a single core and various communication interfaces.
Product Features and Performance
Single-core MPC8xx architecture
32-Bit bus width for efficient data handling
Operating speed of 50MHz
Integrated Communications Processor Module (CPM)
Supports DRAM memory
Surface mount technology
Integrated I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces
Product Advantages
Dedicated communication co-processors to handle networking tasks
Support for multiple memory and peripheral interfaces
Capable of operating in high-temperature environments up to 95°C
Key Technical Parameters
Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Ethernet: 10Mbps (2)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)
Quality and Safety Features
Designed for high reliability and stable operation within specified temperature ranges
Compatibility
Support for a variety of standard communication interfaces for broad peripheral and hardware compatibility
Application Areas
Can be used in networking equipment, industrial control systems, and other communication-focused applications
Product Lifecycle
Obsolete
Replacements or upgrades may be available from NXP Semiconductors' newer product lines
Several Key Reasons to Choose This Product
Supports critical networking functions with dual Ethernet and diverse communication interfaces
Adequate speed and computing power for various embedded applications
Enhanced system integration with on-chip CPM
Resilience to high temperatures making it suitable for industrial environments
Legacy support for applications that require specific MPC8xx series compatibility