Manufacturer Part Number
MPC8323VRADDCA
Manufacturer
NXP Semiconductors
Introduction
The MPC8323VRADDCA is a highly integrated embedded microprocessor from the MPC83xx series, designed to deliver robust and versatile performance for a wide range of embedded applications.
Product Features and Performance
Core Processor: PowerPC e300c2, offering efficient processing capabilities
Number of Cores/Bus Width: 1 Core, 32-Bit, optimizing data management and processing speed
Speed: 266MHz, providing a balance between power consumption and processing capability
Co-Processors/DSP: Communications QUICC Engine, enhancing communication protocols
RAM Controllers: Supports DDR and DDR2, ensuring compatibility with a range of memory technologies
Ethernet: Features 10/100Mbps (3) for reliable network connectivity
USB: USB 2.0 (1) support, facilitating connectivity with peripheral devices
Voltage I/O: 1.8V, 2.5V, 3.3V, accommodating various power supply levels
Operating Temperature: 0°C ~ 105°C (TA), suitable for a wide range of operating environments
Product Advantages
High integration level reduces overall system cost and complexity
Wide range of I/O options enhances connectivity and interoperability
Supports multiple memory technologies, increasing design flexibility
Robust operating temperature range extends applicability to industrial environments
Key Technical Parameters
Core: PowerPC e300c2
Speed: 266MHz
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Operating Temperature: 0°C ~ 105°C (TA)
Quality and Safety Features
Packaged in a 516-BBGA ensuring reliable connectivity and robustness
Compatibility
Supports DDR and DDR2 RAM
Multiple I/O options including USB 2.0, Ethernet, and additional interfaces like PCI, SPI
Application Areas
Networking equipment
Industrial control systems
Embedded computing applications
Product Lifecycle
Status: Active, indicating ongoing production and availability
No current indication of discontinuation, ensuring long-term availability for designs
Several Key Reasons to Choose This Product
Provides a balanced performance-to-power ratio for embedded applications
Versatile connectivity options support a wide range of peripheral devices
High level of integration simplifies design and reduces time to market
Robust operating temperature range makes it suitable for industrial applications
Active product status ensures ongoing support and availability