Manufacturer Part Number
MPC8309CVMADDCA
Manufacturer
NXP Semiconductors
Introduction
The MPC8309CVMADDCA is an embedded microprocessor part of the MPC83xx Series, tailored for advanced embedded systems.
Product Features and Performance
Core Processor: PowerPC e300c3, ensuring efficient handling of computational tasks.
Number of Cores/Bus Width: 1 Core, 32-Bit, optimizing performance and resource utilization.
Speed: 266MHz, providing ample processing power for a variety of applications.
Co-Processors/DSP: Communications; QUICC Engine, enhancing communication protocols execution.
RAM Controllers: DDR2, supporting faster data transfer rates.
Ethernet: 10/100Mbps (3), facilitating network connectivity.
USB: USB 2.0 (1), enabling fast data exchange with peripheral devices.
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM, offering versatile connectivity options.
Product Advantages
High integration level, reducing the need for additional external components.
Embedded QUICC Engine for enhanced communication capabilities.
Broad range of supported interfaces ensuring compatibility with various peripherals.
Suitable for high-temperature operation, ensuring reliability in harsh environments.
Key Technical Parameters
Voltage I/O: 1.8V, 3.3V, accommodating various power supply designs.
Operating Temperature: -40°C ~ 105°C (TA), suitable for extreme condition deployment.
Package / Case: 489-LFBGA, ensuring compact and robust design.
Supplier Device Package: 489-PBGA (19x19), compatible with standard mounting techniques.
Quality and Safety Features
Reliable operation within specified temperature ranges.
Manufactured by NXP Semiconductors, a leader in semiconductor solutions.
Compatibility
Supports a wide range of external interfaces including CAN and USB 2.0.
Compatible with DDR2 RAM controllers, allowing diverse memory solutions.
Application Areas
Industrial control systems
Network communication devices
Embedded computing platforms
Product Lifecycle
Product Status: Obsolete, indicating procurement and future product planning should consider alternatives.
Availability of replacements or upgrades should be consulted with NXP Semiconductors.
Several Key Reasons to Choose This Product
Highly suitable for embedded applications requiring integrated communication features.
Broad operating temperature range catering to demanding environmental conditions.
Compact package design facilitating ease of integration into system designs.
Obsolescence status necessitates strategic planning for long-term deployments.
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