MPC8306CVMABDCA - NXP USA Inc.

Manufacturer Part Number

MPC8306CVMABDCA

Manufacturer

NXP Semiconductors

Introduction

High-performance, low-power PowerPC-based embedded microprocessor

Designed for a wide range of industrial and consumer applications

Product Features and Performance

133MHz PowerPC e300c3 core

32-bit architecture

Integrated DDR2 memory controller

3 x 10/100Mbps Ethernet ports

USB 2.0 interface

CAN, DUART, I2C, MMC/SD, SPI, TDM interfaces

QUICC Engine for advanced communications processing

Product Advantages

Optimized for low-power, high-performance embedded applications

Comprehensive communication and peripheral interfaces

Scalable and flexible architecture to meet diverse application needs

Key Technical Parameters

Package: 369-PBGA (19x19)

Operating temperature: -40°C to 105°C

Supports 1.8V and 3.3V I/O voltages

Quality and Safety Features

RoHS3 compliant

Reliable surface mount package

Compatibility

Compatible with a wide range of embedded systems and applications

Application Areas

Industrial automation and control

Networking and communication equipment

Automotive electronics

Consumer electronics

Product Lifecycle

Current product offering, not near discontinuation

Replacement and upgrade options available from NXP Semiconductors

Key Reasons to Choose This Product

High-performance PowerPC-based processor for demanding embedded applications

Extensive communication and peripheral interfaces for flexible system design

Low-power operation and wide temperature range for industrial environments

Reliable and RoHS-compliant design for long-term product availability