Manufacturer Part Number
MPC8306CVMABDCA
Manufacturer
NXP Semiconductors
Introduction
High-performance, low-power PowerPC-based embedded microprocessor
Designed for a wide range of industrial and consumer applications
Product Features and Performance
133MHz PowerPC e300c3 core
32-bit architecture
Integrated DDR2 memory controller
3 x 10/100Mbps Ethernet ports
USB 2.0 interface
CAN, DUART, I2C, MMC/SD, SPI, TDM interfaces
QUICC Engine for advanced communications processing
Product Advantages
Optimized for low-power, high-performance embedded applications
Comprehensive communication and peripheral interfaces
Scalable and flexible architecture to meet diverse application needs
Key Technical Parameters
Package: 369-PBGA (19x19)
Operating temperature: -40°C to 105°C
Supports 1.8V and 3.3V I/O voltages
Quality and Safety Features
RoHS3 compliant
Reliable surface mount package
Compatibility
Compatible with a wide range of embedded systems and applications
Application Areas
Industrial automation and control
Networking and communication equipment
Automotive electronics
Consumer electronics
Product Lifecycle
Current product offering, not near discontinuation
Replacement and upgrade options available from NXP Semiconductors
Key Reasons to Choose This Product
High-performance PowerPC-based processor for demanding embedded applications
Extensive communication and peripheral interfaces for flexible system design
Low-power operation and wide temperature range for industrial environments
Reliable and RoHS-compliant design for long-term product availability
MPC82G516AFMEGAWIN