Manufacturer Part Number
MPC8270CVVQLDA
Manufacturer
NXP Semiconductors
Introduction
This product is an embedded microprocessor from the MPC82xx series designed for advanced communications and networking applications.
Product Features and Performance
Core Processor: PowerPC G2_LE
Single Core with a 32-Bit Bus Width
High performance with a speed of 333MHz
On-chip communications processor module (CPM)
Integrated DRAM and SDRAM controllers for memory interfacing
Multiple communication interfaces including I2C, SCC, SMC, SPI, UART, USART
Ethernet support for 10/100Mbps x 3 ports
One USB 2.0 interface for peripheral connectivity
Functional at a wide range of temperatures from -40°C to 105°C
Product Advantages
Built-in communications co-processors enhance networking capabilities
High integration helps to reduce system component count and costs
Low-power consumption and advanced power management features
Key Technical Parameters
Operating Speed: 333MHz
Operating Temperature: -40°C to 105°C
Voltage I/O: 3.3V
Number of Cores: 1
Bus Width: 32-Bit
Ethernet Ports: 3
USB Ports: 1
RAM Controllers: DRAM, SDRAM
Packaging: 480-LBGA Exposed Pad
Interface Support: I2C, SCC, SMC, SPI, UART, USART
Quality and Safety Features
Robust operating temperature range ensures stability in varying environments
Conforms to industry standards for surface mount technology
Compatibility
Designed to interface seamlessly with various memory types and communication peripherals
Application Areas
Networking and Telecommunications
Industrial Control Systems
Embedded Computing
Product Lifecycle
Status: Obsolete
As it is nearing discontinuation, alternative models or upgrades should be considered
Several Key Reasons to Choose This Product
High reliability for critical communication applications
Versatile integration capabilities with various interfaces
Superior processing power at 333MHz for demanding tasks
Wide operating temperature suitable for harsh environments
Legacy support for systems utilizing the PowerPC G2_LE architecture