MM912F634DV2AP - NXP USA Inc.

Manufacturer Part Number

MM912F634DV2AP

Manufacturer

NXP Semiconductors

Introduction

An advanced microcontroller designed for embedded applications, particularly tailored for automotive applications requiring reliable operation in rigorous environments.

Product Features and Performance

Embedded microcontroller specifically for application-specific tasks

Core Processor S12 ensures efficient handling of complex computations

Features 32KB of FLASH memory for program storage

Equipped with 2K x 8 RAM for operational data storage

Provides LIN and SCI interfaces for communication capabilities

Supports up to 9 I/O pins for versatile peripheral control

Operates across a wide voltage range of 2.25V to 5.5V

Designed to perform reliably in temperatures ranging from -40°C to 105°C

Product Advantages

High integration level suitable for automotive applications

Robust operation in extreme temperatures suitable for under-hood applications

Versatile communication interface options for enhanced connectivity

Reliable performance backed by NXP Semiconductors' advanced technology

Key Technical Parameters

Core Processor: S12

Program Memory Type: FLASH (32KB)

RAM Size: 2K x 8

Interface: LIN, SCI

Number of I/O: 9

Voltage Supply: 2.25V ~ 5.5V

Operating Temperature: -40°C ~ 105°C

Mounting Type: Surface Mount

Package / Case: 48-LQFP

Quality and Safety Features

Automotive grade ensuring high reliability and performance under stringent conditions

Strict compliance with automotive quality standards

Compatibility

Compatible with a wide range of automotive peripheral devices

Suitable for integration into various automotive systems

Application Areas

Automotive control systems

Embedded systems requiring high reliability

Systems necessitating low-power operation in harsh environments

Product Lifecycle

Active status, indicating ongoing manufacture and support

No current indication of nearing discontinuation, ensuring long-term availability

Several Key Reasons to Choose This Product

Robust design for high-reliability applications in automotive environments

Integrated features reduce additional component requirements, simplifying design and reducing costs

Wide operating temperature range meets automotive under-hood environment requirements

Supported by NXP Semiconductors, a leader in automotive semiconductor solutions

Future-proof investment with current active product status and support from the manufacturer