MK20DN512ZVMD10 Tech Specifications
NXP USA Inc. - MK20DN512ZVMD10 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. - MK20DN512ZVMD10
| Product Attribute | Attribute Value | |
|---|---|---|
| Manufacturer | NXP Semiconductors | |
| Voltage - Supply (Vcc/Vdd) | 1.71V ~ 3.6V | |
| Supplier Device Package | 144-MAPBGA (13x13) | |
| Speed | 100MHz | |
| Series | Kinetis K20 | |
| RAM Size | 128K x 8 | |
| Program Memory Type | FLASH | |
| Program Memory Size | 512KB (512K x 8) | |
| Peripherals | DMA, I²S, LVD, POR, PWM, WDT | |
| Package / Case | 144-LBGA | |
| Package | Tray |
| Product Attribute | Attribute Value | |
|---|---|---|
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 105°C (TA) | |
| Number of I/O | 100 | |
| Mounting Type | Surface Mount | |
| EEPROM Size | - | |
| Data Converters | A/D 42x16b; D/A 2x12b | |
| Core Size | 32-Bit Single-Core | |
| Core Processor | ARM® Cortex®-M4 | |
| Connectivity | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | |
| Base Product Number | MK20DN512 |
| ATTRIBUTE | DESCRIPTION |
|---|---|
| RoHs Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 3A991A2 |
| HTSUS | 8542.31.0001 |
The three parts on the right have similar specifications to NXP USA Inc. MK20DN512ZVMD10
| Product Attribute |  |
 |
 |
 |
|---|---|---|---|---|
| Part Number | MK20DN512ZVMD10 | MK20DN512ZVMC10R | MK20DN512ZVLK10 | MK20DN512ZVMB10 |
| Manufacturer | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. |
| Number of I/O | 100 | 86 | 52 | - |
| Package / Case | 144-LBGA | 121-LFBGA | 80-LQFP | 81-LBGA |
| Series | Kinetis K20 | Kinetis K20 | Kinetis K20 | Kinetis K20 |
| Connectivity | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG |
| Core Processor | ARM® Cortex®-M4 | ARM® Cortex®-M4 | ARM® Cortex®-M4 | ARM® Cortex®-M4 |
| Peripherals | DMA, I²S, LVD, POR, PWM, WDT | DMA, I²S, LVD, POR, PWM, WDT | DMA, I²S, LVD, POR, PWM, WDT | DMA, I²S, LVD, POR, PWM, WDT |
| Supplier Device Package | 144-MAPBGA (13x13) | 121-MAPBGA (8x8) | 80-FQFP (12x12) | 81-MAPBGA (10x10) |
| Program Memory Size | 512KB (512K x 8) | 512KB (512K x 8) | 512KB (512K x 8) | 512KB (512K x 8) |
| Data Converters | A/D 42x16b; D/A 2x12b | A/D 38x16b; D/A 2x12b | A/D 27x16b; D/A 1x12b | - |
| Speed | 100MHz | 100MHz | 100MHz | 100MHz |
| Base Product Number | MK20DN512 | MK20DN512 | MK20DN512 | MK20DN512 |
| EEPROM Size | - | - | - | - |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) |
| Core Size | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core |
| Package | Tray | Tape & Reel (TR) | Tray | Tray |
| RAM Size | 128K x 8 | 128K x 8 | 128K x 8 | 128K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.71V ~ 3.6V | 1.71V ~ 3.6V | 1.71V ~ 3.6V | 1.71V ~ 3.6V |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Program Memory Type | FLASH | FLASH | FLASH | FLASH |
Download MK20DN512ZVMD10 pdf datasheets and NXP USA Inc. documentation for MK20DN512ZVMD10 - NXP USA Inc..
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MK20DN64VMP5NXP USA Inc.IC MCU 32BIT 64KB FLASH 64MAPBGA| Common Countries Logistic Time Reference | ||
|---|---|---|
| Region | Country | Logistic Time(Day) |
| America | United States | 5 |
| Brazil | 7 | |
| Europe | Germany | 5 |
| United Kingdom | 4 | |
| Italy | 5 | |
| Oceania | Australia | 6 |
| New Zealand | 5 | |
| Asia | India | 4 |
| Japan | 4 | |
| Middle East | Israel | 6 |
| DHL & FedEx Shipment Charges Reference | |
|---|---|
| Shipment charges(KG) | Reference DHL(USD$) |
| 0.00kg-1.00kg | USD$30.00 - USD$60.00 |
| 1.00kg-2.00kg | USD$40.00 - USD$80.00 |
| 2.00kg-3.00kg | USD$50.00 - USD$100.00 |
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