Manufacturer Part Number
MIMXRT685SFVKB
Manufacturer
NXP Semiconductors
Introduction
High-performance ARM Cortex-M33 based microcontroller designed for advanced embedded applications
Product Features and Performance
Dual-Core ARM Cortex-M33 at 300MHz
Extensive connectivity with EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Brown-out Detect/Reset, DMA, POR, PWM, WDT peripherals support
96 Input/Output pins
5M x 8 RAM size for robust processing abilities
Supports external program memory for flexible storage options
12x12b analog-to-digital converters included
Internal oscillator for clock generation
Surface mount, 176-VFBGA package for compact PCB design
Product Advantages
High-speed processing for computation-intensive applications
Comprehensive set of peripherals enabling versatile application design
Generous RAM size facilitating complex tasks and processes
Robust connectivity options for flexible interfacing with other components
Designed for automated PCB assembly processes
Key Technical Parameters
Core Processor: ARM Cortex-M33
Core Size: 32-Bit
Speed: 300MHz
Number of I/O: 96
RAM Size: 4.5M x 8
Supply Voltage Range: 1.71V to 3.6V
Operating Temperature Range: -20°C to 70°C
Quality and Safety Features
Internal Brown-out Detect/Reset ensures proper operation under varying voltage conditions
Watchdog Timer (WDT) for system reliability and recovery from failure states
Compatibility
Compatible with various external program memory devices
Interfaces support a wide range of external components for comprehensive system design
Application Areas
Advanced IoT devices
Industrial control systems
Secure applications requiring advanced cryptography
Consumer electronics
Automotive applications
High-performance embedded systems
Product Lifecycle
Product Status: Active
No indication of nearing discontinuation
Upgrades or replacements may be available as part of NXP's broader RT-600 series
Several Key Reasons to Choose This Product
Highly integrated dual-core solution increases system performance
Support for extensive IO and external interfaces suits complex embedded designs
Large internal RAM alleviates the need for frequent external memory accesses
Flexible power supply range eases power design for various applications
Wide operating temperature range suitable for harsh environments
Available in a compact package, ideal for space-constrained applications
Long product lifecycle with active status ensures future availability
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