MCZ33897EFR2 - NXP USA Inc.

Manufacturer Part Number

MCZ33897EFR2

Manufacturer

NXP Semiconductors

Introduction

The MCZ33897EFR2 is a CANbus transceiver designed for high-speed communication within automotive and industrial applications.

Product Features and Performance

Supports CANbus protocol for reliable communication

Single driver/receiver configuration for simplified design

Half-duplex communication capability

Receiver Hysteresis of 500 mV enhances signal integrity

Data rate of 83.33Kbps suitable for moderate speed applications

Operates on a 12V supply voltage

Designed to withstand operating temperatures ranging from -40°C to 125°C

Surface mount 14-SOIC packaging for compact integration

Product Advantages

Ensures robust communication in noisy environments due to high receiver hysteresis

Suitable for applications requiring moderate data transmission speed

Supports a wide range of operating temperatures making it versatile for various environments

Compact packaging allows for efficient use of circuit board space

Key Technical Parameters

Protocol: CANbus

Number of Drivers/Receivers: 1/1

Duplex: Half

Receiver Hysteresis: 500 mV

Data Rate: 83.33Kbps

Voltage Supply: 12V

Operating Temperature: -40°C to 125°C

Mounting Type: Surface Mount

Package / Case: 14-SOIC

Quality and Safety Features

Manufactured by NXP Semiconductors, a leader in quality semiconductor solutions

Designed to meet rigorous automotive and industrial standards

Compatibility

Compatible with CANbus protocol-based systems

Suitable for integration into a variety of automotive and industrial control systems

Application Areas

Automotive communication systems

Industrial automation and control systems

Networked sensor communication

Product Lifecycle

Obsolete status suggesting discontinuation of the product

Customers should seek replacements or upgrades for new designs

Several Key Reasons to Choose This Product

Reliability in noisy environments due to receiver hysteresis feature

Versatility across automotive and industrial applications

Quality manufacturing from NXP Semiconductors

Wide operating temperature range accommodates various deployment scenarios

Compact and efficient packaging design for space-conscious applications