Manufacturer Part Number
MCIMX6D7CVT08AD
Manufacturer
NXP Semiconductors
Introduction
The MCIMX6D7CVT08AD is part of the i.MX6D series of embedded microprocessors specifically designed and optimized for multimedia applications.
Product Features and Performance
Dual-core ARM® Cortex®-A9 processor
Operating speed of 800MHz
Supports NEON™ SIMD extensions for multimedia co-processing
Integrated graphics acceleration
Multiple display and interface controllers including keypad and LCD
Features Ethernet support up to 10/100/1000Mbps
Compatible with SATA 3Gbps
Includes four USB 2.0 interfaces with PHY
Advanced RAM controller supporting LPDDR2, LVDDR3, DDR3
Product Advantages
Robust graphics processing capability
High data transfer rates with Gigabit Ethernet and SATA
Supports a variety of high-speed interfaces and communications protocols
Optimized power usage with multiple I/O voltage levels
Resilient to extreme temperatures ranging from -40°C to 105°C
Key Technical Parameters
Core: ARM® Cortex®-A9
Cores/Bus Width: 2 Core, 32-Bit
Speed: 800MHz
RAM Controllers: LPDDR2, LVDDR3, DDR3
Display Controllers: Keypad, LCD
Ethernet: 10/100/1000Mbps
SATA: SATA 3Gbps
USB: USB 2.0 + PHY (4)
Quality and Safety Features
Operating temperature rated from -40°C to 105°C ensuring performance in extreme conditions
Advanced built-in safety features for data integrity and secure operation
Compatibility
Extensive interface support including CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Surface Mount technology for enhanced compatibility with a variety of board designs
Application Areas
Multimedia systems
Advanced industrial controls
Smart home devices
Automotive infotainment and navigation systems
Communication infrastructure
Product Lifecycle
Currently Active with a long product life expectancy
Not nearing discontinuation with continuous availability of replacements or upgrades
Several Key Reasons to Choose This Product
Powers demanding multimedia applications with dual-core efficiency
Enhanced graphics capabilities for advanced visual applications
High-speed connectivity options expand system functionalities
Temperature resilience enables deployment in harsh environments
Extensive compatibility simplifies system integration and upgrades