Manufacturer Part Number
MCF5275LCVM166
Manufacturer
NXP Semiconductors
Introduction
ColdFire V2 core microcontroller suited for industrial control and networking applications
Product Features and Performance
32-Bit Single-Core ColdFire V2 Processor
Speed of 166MHz for rapid processing
Surface Mount 196-LBGA package for compact design
No Program Memory, ROMless for flexibility in system design
64K x 8 RAM Size for data storage
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB connectivity for versatile interfacing
DMA and WDT peripherals to enhance system functionality
Thirty-two bit bus for efficient data handling
Support for an external oscillator
61 I/O pins for extensive external interactions
Product Advantages
Powerful 32-bit architecture for robust application support
High-speed operation for real-time performance
Multiple connectivity options for easy integration in various systems
Ample RAM for buffering and data management
Direct Memory Access enhances throughput and system efficiency
Designed for industrial and control applications
Key Technical Parameters
Core Size: 32-Bit Single-Core
Speed: 166MHz
Number of I/O: 61
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Operating Temperature: -40°C ~ 85°C (TA)
Program Memory Type: ROMless
Quality and Safety Features
Extended operating temperature range for harsh environments
Dedicated Watchdog Timer for system reliability
Compatibility
Support for multiple communication protocols ensures compatibility with various devices
Application Areas
Industrial control systems
Networking equipment
Communication interfaces
Product Lifecycle
Not For New Designs indicating a shift towards newer technologies
Check for replacements or upgrade options in the MCF527x series or alternative product lines
Several Key Reasons to Choose This Product
High-speed processing capabilities for demanding applications
Extensive connectivity for versatile use in multiple applications
Large number of I/Os to interface with various peripherals
ColdFire V2 core known for reliability and efficiency in embedded applications
Availability of documentation and support for easier product integration
Robust design capable of operating in extreme temperature conditions