MCF5232CVM150 - NXP USA Inc.

Manufacturer Part Number

MCF5232CVM150

Manufacturer

NXP Semiconductors

Introduction

The MCF5232CVM150 is part of the MCF523x series of 32-bit single-core Coldfire V2 microcontrollers designed for embedded applications.

Product Features and Performance

32-Bit Single-Core Coldfire V2 Processor

Operating speed of 150MHz

Supports CANbus, EBI/EMI, I2C, SPI, UART/USART connectivity

97 I/O ports enhancing peripheral interfacing

ROMless program memory configuration

64K x 8 RAM size for data storage

External oscillator type

Utilizes DMA and WDT peripherals

Product Advantages

High-performance processing capabilities at 150MHz

Versatile connectivity options including CANbus and SPI

Significant number of I/O ports for extensive peripheral integration

Compact surface mount 196-LBGA package (15x15)

Key Technical Parameters

Core Size: 32-Bit

Speed: 150MHz

Number of I/O: 97

RAM Size: 64K x 8

Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V

Operating Temperature: -40°C ~ 85°C (TA)

Mounting Type: Surface Mount

Package/Case: 196-LBGA

Quality and Safety Features

Designed to operate within an industrial temperature range of -40°C to 85°C ensuring reliability in harsh conditions

Compatibility

Compatible with various industrial communication and control applications due to its comprehensive connectivity features

Application Areas

Industrial automation

Automotive systems

Embedded control systems

Product Lifecycle

Status: Not For New Designs

The MCF5232CVM150 is not recommended for use in new design applications and may be subject to discontinuation with potential replacements or upgrades available.

Several Key Reasons to Choose This Product

Powerful 32-bit architecture capable of running at 150MHz offers robust performance

Ample I/O ports and memory capabilities accommodate complex embedded applications

Wide range of connectivity options ensures versatility in integrating with other industrial components

Operates reliably within a wide temperature range, suitable for challenging environmental conditions

Compact and efficient packaging suitable for space-constrained applications