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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~MC9S12DP512MPVE~~

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MC9S12DP512MPVE - NXP USA Inc.

Manufacturer Part Number: MC9S12DP512MPVE

Manufacturer: NXP Semiconductors

Allelco Part Number: 32D-MC9S12DP512MPVE

ECAD Model

Parts Description: IC MCU 16BIT 512KB FLASH 112LQFP

Detailed Description

Package: 112-LQFP

Data sheet: MC9S12D Family Prod Brief.pdf
MC9S12DP512 Guide.pdf

RoHs Status: ROHS3 Compliant

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In stock: 755

Specifications

MC9S12DP512MPVE Tech Specifications
NXP USA Inc. - MC9S12DP512MPVE technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. - MC9S12DP512MPVE

Product Attribute	Attribute Value
Manufacturer	NXP Semiconductors
Voltage - Supply (Vcc/Vdd)	2.35V ~ 5.25V
Supplier Device Package	112-LQFP (20x20)
Speed	25MHz
Series	HCS12
RAM Size	12K x 8
Program Memory Type	FLASH
Program Memory Size	512KB (512K x 8)
Peripherals	PWM, WDT
Package / Case	112-LQFP
Package	Tray

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 125°C (TA)
Number of I/O	91
Mounting Type	Surface Mount
EEPROM Size	4K x 8
Data Converters	A/D 16x10b
Core Size	16-Bit
Core Processor	HCS12
Connectivity	CANbus, I²C, SCI, SPI
Base Product Number	MC9S12

Parts Introduction

Manufacturer Part Number

MC9S12DP512MPVE

Manufacturer

NXP Semiconductors

Introduction

HCS12 Family Microcontroller for Embedded Applications

Product Features and Performance

16-Bit HCS12 Core Processor

Speed at 25MHz

Multiple Connectivity Options: CANbus, I2C, SCI, SPI

Peripheral Support Including PWM and Watchdog Timer (WDT)

High Number of I/O: 91 Channels

Large Program Memory: 512KB FLASH

Data Storage: 4KB EEPROM and 12KB RAM

Broad Supply Voltage Range: 2.35V to 5.25V

Analog Integration with 16-Channel, 10-bit A/D Converter

Internal Oscillator for Clock Generation

Extended Temperature Range Operation: -40°C to 125°C

Product Advantages

High Integration for Small Footprint Designs

Robust Peripheral Set for Versatile Application Support

Abundant Program and Data Memory for Complex Applications

Low Power Consumption with Various Power Saving Modes

Wide Voltage Range Ensures Flexibility in Power Supply Design

Key Technical Parameters

Core Size: 16-Bit

Operating Speed: 25MHz

Program Memory: 512KB FLASH

EEPROM: 4KB

RAM: 12KB

Analog to Digital Conversion: 16x10b

Operating Temperature: -40°C to 125°C

Quality and Safety Features

Enhanced System Integrity with Watchdog Timer

Stable Operation Across Extended Temperature Ranges

Quality Assured by Industry-Leading Semiconductor Manufacturer

Compatibility

Standard LQFP 112-Pin Surface Mount Package

Compatibility with Various HCS12 Development Tools

Application Areas

Automotive Electronics

Industrial Control Systems

Robotics and Automation

Consumer Electronics

Communication Systems

Product Lifecycle

Status: Active

Normal Availability with Routine Production

No Near-Term Discontinuation Expected

Several Key Reasons to Choose This Product

Optimized for Complex, Real-Time Control Applications

Large I/O Count for Enhanced Interaction with Connected Systems

Flexibility in Design with Various Connectivity Interfaces

A Comprehensive Set of Embedded Control Peripherals

Reliable Operation in Harsh Industrial and Automotive Environments

Backed by NXP’s Reputation and Support in the Embedded Market

Ideal for Scalable Designs Offering Long-Term Availability

Parts with Similar Specifications

The three parts on the right have similar specifications to NXP USA Inc. MC9S12DP512MPVE

Product Attribute
Part Number	MC9S12DP512MPVE	MC9S12DP256BMPV	MC9S12DJ64CFUE	MC9S12DT128BCPV
Manufacturer	NXP USA Inc.	NXP USA Inc.	NXP USA Inc.	NXP USA Inc.
Core Size	16-Bit	16-Bit	16-Bit	16-Bit
Supplier Device Package	112-LQFP (20x20)	112-LQFP (20x20)	80-QFP (14x14)	112-LQFP (20x20)
Number of I/O	91	91	59	91
Oscillator Type	Internal	Internal	Internal	Internal
Data Converters	A/D 16x10b	A/D 16x10b	A/D 8x10b	A/D 16x10b
Program Memory Type	FLASH	FLASH	FLASH	FLASH
Series	HCS12	HCS12	HCS12	HCS12
Program Memory Size	512KB (512K x 8)	256KB (256K x 8)	64KB (64K x 8)	128KB (128K x 8)
Base Product Number	MC9S12	MC9S12	MC9S12	MC9S12
EEPROM Size	4K x 8	4K x 8	1K x 8	2K x 8
RAM Size	12K x 8	12K x 8	4K x 8	8K x 8
Package / Case	112-LQFP	112-LQFP	80-QFP	112-LQFP
Peripherals	PWM, WDT	PWM, WDT	PWM, WDT	PWM, WDT
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount
Speed	25MHz	25MHz	25MHz	25MHz
Package	Tray	Tray	Tray	Tray
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Core Processor	HCS12	HCS12	HCS12	HCS12
Voltage - Supply (Vcc/Vdd)	2.35V ~ 5.25V	2.35V ~ 5.25V	2.35V ~ 5.25V	2.35V ~ 5.25V
Connectivity	CANbus, I²C, SCI, SPI	CANbus, I²C, SCI, SPI	CANbus, I²C, SCI, SPI	CANbus, I²C, SCI, SPI

MC9S12DP512MPVE Datasheet PDF

Download MC9S12DP512MPVE pdf datasheets and NXP USA Inc. documentation for MC9S12DP512MPVE - NXP USA Inc..

PCN Packaging: All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf
Environmental Information: NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf
PCN Design/Specification: Mult Dev 25/May/2020.pdf Trace Marking Removal 20/Jun/2019.pdf
HTML Datasheet: MC9S12D Family Prod Brief.pdf MC9S12DP512 Guide.pdf

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America	United States	5
America	Brazil	7
Europe	Germany	5
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Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

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1.00kg-2.00kg	USD$40.00 - USD$80.00
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