MC34VR500VAES - NXP USA Inc.

Manufacturer Part Number

MC34VR500VAES

Manufacturer

nxp-semiconductors

Introduction

The MC34VR500VAES from NXP Semiconductors is a specialized power management integrated circuit (PMIC) designed for QorIQ LS1/T1 communication processors. It provides efficient, stable power management and is optimized for high-performance applications.

Product Features and Performance

Integrated multiple supply rails for diverse system requirements

High efficiency and low power consumption

Supports a wide range of operating temperatures from -40°C to 105°C

Customizable voltage outputs for various components

Built-in safety features for overcurrent and thermal protection

Product Advantages

Optimized for QorIQ LS1/T1 communications processors, ensuring compatibility and performance

Extended temperature range supports usage in harsh environments

Compact 56-VFQFN package with wettable flanks for enhanced solderability and thermal management

Key Technical Parameters

Current Supply: 15mA

Voltage Supply: 2.8V ~ 4.5V

Operating Temperature: -40°C ~ 105°C

Mounting Type: Surface Mount, Wettable Flank

Package / Case: 56-VFQFN Exposed Pad

Supplier Device Package: 56-QFN-EP (8x8)

Quality and Safety Features

Integrated overcurrent and overheating protection mechanisms

High-quality construction for long-term reliability

Conforms to global safety and quality standards

Compatibility

Specially engineered for QorIQ LS1/T1 communications processors

Flexible voltage supply range for compatibility with various components

Application Areas

Designed for use in networking and telecommunications equipment

Ideal for applications requiring efficient power management for multiple voltage rails

Product Lifecycle

Status: Active, not nearing discontinuation

Continuous support and availability of replacements or upgrades

Several Key Reasons to Choose This Product

Highly efficient and reliable PMIC designed specifically for QorIQ communications processors

Broad operating temperature range suitable for challenging environments

Compact and efficient packaging facilitates easy integration into system designs

Enhanced safety features protect against potential damage and ensure system stability

Long-term product support and active product status secure future availability