MC33PF8200DEES - NXP USA Inc.

Manufacturer Part Number

MC33PF8200DEES

Manufacturer

NXP Semiconductors

Introduction

The MC33PF8200DEES is a specialized power management IC designed for high performance applications, particularly suited for the i.MX 8 and S32x processor series.

Product Features and Performance

Power Management IC specialized for high-performance applications

Designed for i.MX 8 and S32x processor series

Operates over a wide supply voltage range of 2.5V to 5.5V

Supports a broad operating temperature range from -40°C to 105°C

Available in a 56-VFQFN Exposed Pad package

Surface Mount, Wettable Flank for better soldering and inspection

Features multiple programmable voltage outputs for system flexibility

Product Advantages

Provides stable and efficient power management for advanced processors

Enhanced thermal performance due to exposed pad package

Offers design flexibility with multiple configurable outputs

Key Technical Parameters

Supply Voltage Range: 2.5V ~ 5.5V

Operating Temperature Range: -40°C ~ 105°C

Package: 56-VFQFN Exposed Pad

Mounting Type: Surface Mount, Wettable Flank

Supplier Device Package: 56-HVQFN (8x8)

Quality and Safety Features

Built to operate reliably in a wide temperature range suitable for industrial applications

Designed in compliance with industry standards for power management ICs

Compatibility

Intended for use with high performance i.MX 8 and S32x Processors

Compatible with applications requiring a voltage supply between 2.5V and 5.5V

Application Areas

Advanced industrial processors

High-end embedded systems

Automotive infotainment and driver assist systems

Any design requiring robust power management solutions

Product Lifecycle

Active product with ongoing manufacturer support

No indication of discontinuation, ensuring long-term availability

Upgrades and replacements are generally available through the nxp-semiconductors product line

Several Key Reasons to Choose This Product

Optimized for i.MX 8 and S32x processor power requirements

Wettable Flank package provides enhanced soldering and inspection capability

Enhanced power efficiency and thermal performance for demanding applications

Operational across a wide voltage and temperature range for versatile use

Long product lifecycle with support from NXP Semiconductors

Highly configurable for a variety of design specifications and needs