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HomeProductsIntegrated Circuits (ICs)PMIC - Power Management - SpecializedMC33FS8530A1ES
NXP USA Inc.
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See specifications for product details.

MC33FS8530A1ES - NXP USA Inc.

Manufacturer Part Number
MC33FS8530A1ES
Manufacturer
NXP Semiconductors
Allelco Part Number
32D-MC33FS8530A1ES
ECAD Model
Parts Description
SYSTEM BASIS CHIP FS8500
Detailed Description
Package
56-VFQFN Exposed Pad
Data sheet
MC33FS8530A1ES.pdf
RoHs Status
ROHS3 Compliant
In stock: 6481

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Quantity

Specifications

MC33FS8530A1ES Tech Specifications
NXP USA Inc. - MC33FS8530A1ES technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. - MC33FS8530A1ES

Product Attribute Attribute Value  
Manufacturer NXP Semiconductors  
Voltage - Supply 60V  
Supplier Device Package 56-HVQFN (8x8)  
Series -  
Package / Case 56-VFQFN Exposed Pad  
Package Tray  
Product Attribute Attribute Value  
Operating Temperature -40°C ~ 125°C (TA)  
Mounting Type Surface Mount, Wettable Flank  
Current - Supply 15mA  
Base Product Number MC33FS8530  
Applications System Basis Chip  

Parts Introduction

Manufacturer Part Number

MC33FS8530A1ES

Manufacturer

NXP Semiconductors

Introduction

The MC33FS8530A1ES is a System Basis Chip from NXP Semiconductors, specifically designed for advanced power management in automotive applications.

Product Features and Performance

Supports 60V input voltage

Operational over a wide temperature range from -40°C to 125°C

Supplied in a 56-VFQFN exposed pad package

Current supply is maintained at 15mA

Integrated with high voltage capability

Product Advantages

Enhanced durability and operational reliability under extreme conditions

Compact packaging supports sophisticated designs requiring high-density integration

Efficient power management capabilities

Key Technical Parameters

Voltage Supply: 60V

Operating Temperature: -40°C to 125°C

Current Supply: 15mA

Package/Case: 56-VFQFN Exposed Pad

Quality and Safety Features

Robust construction suitable for tough environmental conditions

Tested for operational stability across full range of specified temperatures

Compatibility

Designed for surface mount with a wettable flank to provide strong solder joints

Application Areas

Widely applicable in automotive power management systems

Product Lifecycle

Status: Active

The product is currently active without any indication of discontinuation, and any future replacements or upgrades will likely maintain compatibility with existing systems.

Several Key Reasons to Choose This Product

High voltage support up to 60V making it suitable for various automotive applications

Low operational current requirement which enhances energy efficiency

Broad operating temperature range catering to extreme environmental conditions

Compact and reliable package design optimizes system space and enhances durability

Active product status ensures sustained supply and support

Parts with Similar Specifications

The three parts on the right have similar specifications to NXP USA Inc. MC33FS8530A1ES

Product Attribute MC33FS8530A1ES MC33FS8410G3ES MC33FS8510D3ESR2 MC33FS8510D3ES
Part Number MC33FS8530A1ES MC33FS8410G3ES MC33FS8510D3ESR2 MC33FS8510D3ES
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP Semiconductors
Mounting Type Surface Mount, Wettable Flank Surface Mount, Wettable Flank Surface Mount, Wettable Flank -
Package Tray Tray Tape & Reel (TR) -
Voltage - Supply 60V 60V 60V -
Package / Case 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad -
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -
Applications System Basis Chip System Basis Chip Automotive, Power Supplies -
Current - Supply 15mA 15mA - -
Series - - - -
Supplier Device Package 56-HVQFN (8x8) 56-HVQFN (8x8) 56-HVQFN (8x8) -
Base Product Number MC33FS8530 MC33FS8410 MC33FS8510 -

MC33FS8530A1ES Datasheet PDF

Download MC33FS8530A1ES pdf datasheets and NXP USA Inc. documentation for MC33FS8530A1ES - NXP USA Inc..

PCN Packaging
All Dev Label Update 15/Dec/2020.pdf Mult Dev Pkg Seal 15/Dec/2020.pdf
Environmental Information
NXP USA Inc REACH.pdf NXP USA Inc RoHS Cert.pdf
PCN Assembly/Origin
Mult Dev A/T Site 28/Apr/2021.pdf
PCN Design/Specification
Datasheet Update 26/May/2021.pdf FS8400_FS8500 DS Rev 2/Feb/2022.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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NXP USA Inc.

MC33FS8530A1ES

NXP USA Inc.
32D-MC33FS8530A1ES

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