MC33FS6513CAE - NXP USA Inc.

Manufacturer Part Number

MC33FS6513CAE

Manufacturer

nxp-semiconductors

Introduction

The MC33FS6513CAE by NXP Semiconductors is a specialized power management integrated circuit (PMIC) designed for system basis chip applications. It offers versatility in power management within automotive and industrial systems.

Product Features and Performance

Specialized for system basis chip applications.

Operates over a wide supply voltage range of 1V to 5V.

Designed to withstand operating temperatures from -40°C to 125°C.

Surface mount packaging for efficient assembly and space conservation on PCBs.

Encased in a 48-LQFP Exposed Pad package for improved thermal performance.

Compatible with various microcontroller units (MCUs) due to its flexible voltage supply.

Product Advantages

Supports a wide range of power supply voltages, enhancing compatibility.

High-temperature tolerance makes it suitable for harsh environments.

Compact 48-HLQFP (7x7) package saves PCB space.

The exposed pad package design enhances heat dissipation.

Key Technical Parameters

Voltage Supply: 1V ~ 5V

Operating Temperature: -40°C ~ 125°C

Mounting Type: Surface Mount

Package / Case: 48-LQFP Exposed Pad

Supplier Device Package: 48-HLQFP (7x7)

Quality and Safety Features

Designed and tested to meet stringent quality and safety standards for automotive and industrial applications.

Compatibility

Highly compatible with a wide range of systems and applications due to its versatile power supply voltage and operating temperature range.

Application Areas

Automotive systems

Industrial control systems

Embedded systems requiring specialized power management

Product Lifecycle

Currently in Active product status. Not nearing discontinuation, ensuring availability for future projects.

Several Key Reasons to Choose This Product

High reliability and performance in extreme conditions due to its wide operating temperature range.

Flexible power supply compatibility from 1V to 5V.

Compact design ideal for space-constrained applications.

Enhanced thermal management with exposed pad LQFP packaging.

Active product status ensures long-term availability and support.