MC32PF3001A3EP - NXP USA Inc.

Manufacturer Part Number

MC32PF3001A3EP

Manufacturer

NXP Semiconductors

Introduction

The MC32PF3001A3EP is a specialized power management integrated circuit (PMIC) designed for processor applications, providing efficient power control within a compact package.

Product Features and Performance

Advanced power management for processors

Supports a supply voltage range from 2.8V to 5.5V

Operates efficiently across a wide temperature range from -40°C to 85°C

Provided in a 48-VFQFN exposed pad package, ensuring good heat dissipation

Designed for surface mount technology for simplified PCB assembly

Product Advantages

High reliability and stability under varying voltage and temperature conditions

Compact size contributes to space-saving on PCB layouts

Enhanced thermal management with exposed pad design

Key Technical Parameters

Voltage Supply: 2.8V ~ 5.5V

Operating Temperature: -40°C ~ 85°C

Package/Case: 48-VFQFN Exposed Pad

Mounting Type: Surface Mount

Quality and Safety Features

Constructed to meet high industry standards for safety and durability

Undergoes rigorous quality control measurements

Compatibility

Specifically designed for use in processor applications

Application Areas

Suited for use in computing technology where processor efficiency and power management are essential

Product Lifecycle

Currently in an active product lifecycle phase

No indication of nearing discontinuation

Replacement parts or upgrades are typically available for active products

Several Key Reasons to Choose This Product

Guaranteed performance across a broad operational temperature range

Efficient power management tailored specifically for processor applications

Compact and thermally efficient package design suitable for advanced electronic assemblies

Reliable operations supported by NXP Semiconductors’ robust manufacturing standards