Manufacturer Part Number
MC32PF1510A6EP
Manufacturer
NXP Semiconductors
Introduction
Power management IC for embedded and low-power applications
Product Features and Performance
Power Management Integrated Circuit (PMIC)
Specialized for power management tasks
Available in a Tray packaging for safe transport and handling
Operating temperature from -40°C to 85°C suitable for diverse environments
Surface Mount Technology (SMT) for modern PCB assembly processes
40-VFQFN Exposed Pad to enhance thermal dissipation
Designed for embedded systems, IoT, and mobile/wearable devices
Product Advantages
Optimizes power efficiency and extends battery life in portable devices
Compact 40-HVQFN (5x5) package size suitable for space-constrained applications
Robust operating temperature range ensures reliability across various environments
Key Technical Parameters
Supply Voltage range 4.1V to 6V
40-VFQFN Exposed Pad offers efficient heat dissipation
Enhanced ESD protection and electrical safety features
Quality and Safety Features
Built to meet industry standards for quality and reliability
Designed with safety mechanisms to protect against overcurrent and thermal overload
Compatibility
Compatible with a range of microcontrollers and processors for embedded applications
Flexible input voltage to accommodate various battery technologies
Application Areas
Suitable for embedded systems
Ideal for low-power IoT devices
Designed for mobile and wearable technology
Product Lifecycle
Currently active product with no announced discontinuation
Support for replacements and upgrades as part of the MC32PF1510 series
Key Reasons to Choose This Product
Energy-efficient design for battery-powered devices
Supports a wide range of core and I/O voltages, enhancing device compatibility
Reliable operation in extreme temperature conditions
Small footprint, making it ideal for compact electronic devices
Long-term availability as part of NXP's commitment to product lifecycle management
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