VNC2-48L1C-REEL - FTDI, Future Technology Devices International Ltd

Manufacturer Part Number

VNC2-48L1C-REEL

Manufacturer

Future Technology Devices International

Introduction

VNC2-48L1C-REEL is part of Future Technology Devices International's Vinculum-II series, acting as an interface controller for USB connectivity applications.

Product Features and Performance

USB protocol support with enhanced interface options

Integrated SPI and UART interfaces for broad peripheral connectivity

Compliant with USB 2.0 standards for seamless data transfer

Low operating voltage, ideal for embedded systems

Efficient power consumption at 25mA current supply

Wide operating temperature spectrum for diverse environments

Product Advantages

Flexible connection options bolster design scalability

High integration supports reduced component count and system cost

Reliability in varying temperatures ensures robust performance

Key Technical Parameters

Protocol: USB

Function: Controller

Interface: SPI, UART

Standards: USB 2.0

Voltage Supply: 3.3V

Current Supply: 25mA

Operating Temperature: -40°C ~ 85°C

Package / Case: 48-LQFP

Supplier Device Package: 48-LQFP (7x7)

Quality and Safety Features

Stringent adherence to international USB 2.0 standards

Robust package design for enhanced durability

Compatibility

Interoperable with various USB-equipped devices

Suitable for use in systems requiring SPI or UART interfaces

Application Areas

Consumer electronics

Embedded systems

Industrial controls

Data communication equipment

Product Lifecycle

Currently Active. Potential future changes to product status will depend on market demands and technological evolution.

Several Key Reasons to Choose This Product

Broad operational temperature range making it suitable for diverse applications

Low power requirements facilitating use in portable devices

High level of integration for space-constrained equipment

Future Technology Devices International's robust support and product reliability

The Vinculum-II series is well-documented for ease of design and implementation

Available in tape and reel packaging for efficient assembly processes