FT245RL-REEL - FTDI, Future Technology Devices International Ltd

Manufacturer Part Number

FT245RL-REEL

Manufacturer

Future Technology Devices International

Introduction

USB to FIFO interface bridge chip in SSOP package

Product Features and Performance

USB to FIFO protocol conversion

Integrated 1024-bit internal EEPROM for configuration

USB 2.0 Full-Speed compatible

FIFO interface with bi-directional data transfer

Fully integrated clock generation with no external crystal required

Supports bus-powered and self-powered configurations

Asynchronous and synchronous bit-bang mode interface options

UART and bit-bang mode interfaces

Product Advantages

Simplifies USB integration for devices requiring FIFO interface

Eliminates firmware complexity for USB protocol management

Provides flexibility with configurable I/O transfer rates

Enables design longevity with internal oscillator

Robust design capable of operating in extended temperature ranges

Key Technical Parameters

Protocol: USB

Function: Bridge, USB to FIFO

Interface: FIFO

Standards: USB 2.0

Voltage Supply: 1.8V to 5.25V

Current Supply: 15mA

Operating Temperature: -40°C to 85°C

Package / Case: 28-SSOP

Supplier Device Package: 28-SSOP

Quality and Safety Features

Integrated power-on-reset circuit

Overcurrent protection

High level of integration for reliability

Lead-free and RoHS compliant

Compatibility

Compatible with USB 2.0 Full-Speed specifications

Compatible with various FIFO interfaces

Directly interfaces with microcontrollers and FPGAs

Application Areas

Industrial controls

Data acquisition systems

Printers

Medical devices

Scientific instrumentation

Product Lifecycle

Not recommended for new designs (NRND)

Possible existence of newer versions or replacements available

Several Key Reasons to Choose This Product

Streamlines development process for systems needing USB connectivity

High integration reduces external component count, saving space and cost

Proven reliability and widespread acceptance in industry

Extended temperature range makes it suitable for industrial applications

Tape & Reel packaging ensures compatibility with automated PCB assembly processes

FTDI provides support and documentation, simplifying implementation