C8051F580-IM - Silicon Labs

Manufacturer Part Number

C8051F580-IM

Manufacturer

Silicon Labs

Introduction

Embedded Microcontroller within the C8051F58x Series

Product Features and Performance

8-Bit 8051 Core Processor

Speed up to 50MHz

Advanced connectivity with EBI/EMI, SMBus, CANbus, LINbus, SPI, UART/USART

On-chip peripherals like POR, PWM, Temp Sensor, WDT

High I/O count with 40 programmable pins

128KB FLASH Program Memory

25KB x 8 RAM

Internal Oscillator

Wide Voltage Supply Range from 1.8V to 5.25V

High-Resolution Analog to Digital Converters (32x12b)

Product Advantages

High-speed CPU operation

Flexible and varied communication interfaces

Robust peripheral set for diverse applications

Adequate memory for complex programming

Operational across a broad temperature range

Designed for automated surface mount assembly

Compact 48-QFN package saving PCB space

Key Technical Parameters

50MHz Operating Speed

128KB Program Memory Size

25KB RAM Size

32x12-bit A/D Converters

40 Number of I/O

Operating Temperature from -40°C to 125°C

Quality and Safety Features

Built-in Watchdog Timer (WDT)

Power-On Reset (POR) circuitry

Temperature Sensor for thermal monitoring

Compatibility

Compatible with SMBus and I2C protocols

Supports CAN and LIN automotive buses

SPI interface for high-speed synchronous communication

Readable and writable FLASH memory

QFN package compatible with standard surface mount technology

Application Areas

Industrial Automation

Automotive Electronics

Consumer Electronics

Telecommunications

Embedded Control Systems

Product Lifecycle

Product Status: Active

No near-term discontinuation

Replacement and upgrade options available

Key Reasons to Choose This Product

High-frequency operation for time-sensitive applications

Versatile interface options fit for modern communication needs

Substantial on-chip memory enabling complex program execution

Wide-ranging power supply compatibility

Supports both analog and digital sensor integration

Sustainable operational quality across extreme temperature environments

Compact form factor suited to space-constrained designs