Manufacturer Part Number
CY7C194-25SC
Manufacturer
Infineon Technologies
Introduction
The Infineon CY7C194-25SC is a high-performance, high-density SRAM (Static Random-Access Memory) chip with a capacity of 256Kbit. It features a parallel memory interface and is designed for a wide range of applications that require fast, reliable, and power-efficient memory solutions.
Product Features and Performance
256Kbit of SRAM memory organized as 64K x 4
Asynchronous SRAM technology
Fast access time of 25ns
Wide operating voltage range of 4.5V to 5.5V
Operating temperature range of 0°C to 70°C (TA)
Low power consumption
Product Advantages
High-density SRAM memory for efficient resource utilization
Fast access time for real-time data processing
Wide operating voltage and temperature range for versatile applications
Asynchronous SRAM design for simplified system integration
Key Reasons to Choose This Product
Reliable and high-performance SRAM solution
Cost-effective memory option for a variety of applications
Ease of integration and compatibility with many system designs
Consistent quality and safety assured by Infineon's manufacturing standards
Quality and Safety Features
Rigorous quality control measures during production
Compliance with industry safety and reliability standards
Robust design for long-term, dependable operation
Compatibility
The Infineon CY7C194-25SC SRAM chip is compatible with a wide range of electronic systems and devices that require fast, reliable, and power-efficient memory solutions.
Application Areas
Industrial automation and control systems
Embedded systems and microcontroller-based designs
Network and communication equipment
Consumer electronics and household appliances
Medical and healthcare devices
Transportation and automotive applications
Product Lifecycle
The Infineon CY7C194-25SC is an active, in-production product. There are no plans for discontinuation at this time. Customers are advised to consult with our website's sales team for information on any equivalent or alternative models that may become available in the future.