Manufacturer Part Number
IR2136STRPBF
Manufacturer
infineon-technologies
Introduction
The IR2136STRPBF is part of infineon-technologies's portfolio designed for efficient power management, specifically tailored for gate driving capabilities with three-phase applications.
Product Features and Performance
Half-Bridge Driven Configuration
3-Phase Channel Type
Supports 6 Drivers
Compatible with IGBT and N-Channel MOSFET Gate Types
Voltage supply range from 10V to 20V
Logic Voltage levels at 0.8V (VIL) and 3V (VIH)
Peak Output Current 200mA (Source), 350mA (Sink)
Inverting Input Type
High Side Voltage handling up to 600 V (Bootstrap)
Rise Time 125ns, Fall Time 50ns
Operates in temperatures from -40°C to 150°C
Product Advantages
Designed for high efficiency and reliability in three-phase applications.
The multi-driver capability allows comprehensive control over multiple outputs.
Key Technical Parameters
Supply Voltage: 10V ~ 20V
Logic Voltage - VIL, VIH: 0.8V, 3V
Peak Output Current (Source, Sink): 200mA, 350mA
High Side Voltage - Max (Bootstrap): 600V
Operating Temperature: -40°C ~ 150°C
Quality and Safety Features
Robust thermal management supports operating temperatures up to 150°C.
High-voltage capability up to 600V for reliable high-side driving.
Compatibility
Optimized for IGBT and N-Channel MOSFET technologies.
Suitable for surface mount technology with 28-SOIC package.
Application Areas
Ideal for motor controllers, inverters, and other power management solutions within industrial applications.
Product Lifecycle
The product status is currently active, with no indications of discontinuation. Continuous availability of replacements or upgrades.
Several Key Reasons to Choose This Product
Flexible supply voltage compatibility from 10V to 20V supporting various design requirements.
Dual current capacities for source and sink to increase driving capabilities.
High-temperature operation up to 150°C allowing usage in rigorous environments.
Multi-channel and dual technology gate driver maximizes utility across different applications.
Compact SOIC packaging beneficial for space-sensitive applications.