CYWB0124ABX-FDXIT - Infineon Technologies

Manufacturer Part Number

CYWB0124ABX-FDXIT

Manufacturer

infineon-technologies

Introduction

The CYWB0124ABX-FDXIT is part of the West Bridge® Antioch™ series, designed by Infineon Technologies for interface control in embedded systems. It facilitates efficient data transfer between USB and memory card interfaces.

Product Features and Performance

Supports USB 2.0 for high-speed data transfer.

Interface compatibility with parallel systems.

Operates effectively within a supply voltage range of 1.8V to 3.3V.

Designed for harsh conditions, with an operating temperature range from -40°C to 85°C.

Product Advantages

Enables seamless integration of USB and memory card functions.

Enhanced data management and transfer rate efficiency compared to similar models.

Low voltage operation for energy-efficient designs.

Robust performance in extreme temperature environments.

Key Technical Parameters

Interface: Parallel

Protocol: USB, Memory Card

Supply Voltage: 1.8V ~ 3.3V

Operating Temperature: -40°C ~ 85°C

Standards: USB 2.0

Package: 81-UFBGA, WLCSP

Quality and Safety Features

Designed to meet high reliability and safety standards in data transfer.

Comprehensive quality testing under varying environmental conditions.

Compatibility

Can be integrated into a wide range of systems requiring high-speed data transfer between USB and memory cards.

Flexible use across various platforms due to its parallel interface.

Application Areas

Embedded systems

Consumer electronics

Data management solutions

Industrial control

Mobile devices

Product Lifecycle

Obsolete. It’s crucial to note that this product is nearing the end of its lifecycle, with limited availability. Manufacturers or users should seek replacements or upgrades.

Several Key Reasons to Choose This Product

Superior data transfer efficiency with USB 2.0 support.

Flexible voltage operation suitable for a wide range of application requirements.

Durable design, capable of operating in extreme environmental conditions.

Low energy consumption, contributing to the development of eco-friendly products.

Comprehensive compatibility and integration capabilities across various systems and platforms.