CYW20730A1KFBGT - Infineon Technologies

Manufacturer Part Number

CYW20730A1KFBGT

Manufacturer

Infineon Technologies

Introduction

Highly integrated Bluetooth 3.0 system-on-chip (SoC) solution

Combines a radio frequency (RF) transceiver and a microcontroller unit (MCU) on a single chip

Product Features and Performance

Operates in the 2.4GHz frequency band

Supports data rates up to 1Mbps

Receiver sensitivity of -88dBm

Transmit power output of 4dBm

Integrated Power Amplifier (PA) and Low Noise Amplifier (LNA)

4 GPIO pins for customizable functionality

Product Advantages

Highly integrated, single-chip solution reduces design complexity and cost

Low power consumption for extended battery life in portable applications

Comprehensive software stack and development tools support

Key Technical Parameters

Operating voltage: 1.2V

Operating temperature range: 0°C to 70°C

Package: 64-FBGA (7x7), Tape & Reel (TR)

Current consumption: 19mA ~ 24mA (transmit), 26.6mA (receive)

Quality and Safety Features

RoHS3 compliant for environmental responsibility

Extensive testing and reliability measures ensure product quality

Compatibility

Supports Bluetooth v3.0 protocol

Can be used in a wide range of Bluetooth-enabled applications

Application Areas

Wireless personal area networks (WPANs)

Bluetooth-enabled devices, such as smartphones, tablets, wearables, and IoT devices

Product Lifecycle

Currently in active production

Replacement or upgrade options available from the manufacturer

Several Key Reasons to Choose This Product

Highly integrated, single-chip solution for simplified design and reduced costs

Low power consumption for extended battery life in portable applications

Comprehensive software support and development tools for faster time-to-market

Proven reliability and quality through rigorous testing and compliance measures

Compatibility with the widely adopted Bluetooth v3.0 standard