CYW15G0403DXB-BGI - Infineon Technologies

Manufacturer Part Number

CYW15G0403DXB-BGI

Manufacturer

Infineon Technologies

Introduction

The CYW15G0403DXB-BGI is part of Infineon Technologies' HOTlink II™ series designed for interface telecom applications

Product Features and Performance

Interface Telecom component

Part of the HOTlink II™ series

Surface mount 256-BGA exposed pad packaging

Four individual circuits integrated

Product Advantages

Designed for efficient data communication in telecom systems

Surface mount packaging enables compact board design

Key Technical Parameters

Supply Voltage range of 3.135V to 3.465V

256-L2BGA (27x27) device package

Number of Circuits: 4

Base Product Number: CYW15G0403

Quality and Safety Features

Manufactured by Infineon Technologies, known for high quality and reliability

Compatibility

Specifically designed for use in telecom interface applications with compatible supply voltage requirements

Application Areas

Telecom systems

Data communication equipment

Product Lifecycle

Obsolete status - not recommended for new designs

Potential replacement or upgrade options may exist within Infineon's product range

Several Key Reasons to Choose This Product

Optimized for telecom interface applications

Part of the reliable HOTlink II™ series

Manufactured by industry-leading Infineon Technologies

Supports precise voltage requirements with a range of 3.135V to 3.465V

Enables compact circuit design with surface mount technology